Course Description In this course, you learn the complete flow of a System in Package (SiP) design, from defining the module outline to placing components, defining a netlist, placement, routing, documentation, and manufacturing output. You also learn the complete design flow for a flip-chip and wire-bonded stacked die module using the Cadence® SiP Layout software.
Learning Objectives
After completing this course, you will be able to:
Develop a process flow to suit your design needs
Create a cross section and design constraints in your SiP layout database
Wire bond a stacked die design
Use the 3D viewer to check your design in three dimensions
Route an SiP design using interactive and automatic methods
Generate a variety of manufacturing outputs for your SiP design
Software Used in This Course
Cadence SiP Layout – XL
Advanced Package Router Option
Software Release(s)
17.2-2016
Modules in this Course
Introducing SiP Layout
Creating a New Package Design
Modifying Components and Netlist
Setting Design Rules
Power Rings and Wire Bonding
Die Stacks and 3D Viewing
Routing
High-Density Interconnect
Embedded Components
Design Verification and Manufacturing Output
Audience
IC package and SiP designers
Prerequisites Before taking this course, you should have a working knowledge of:
