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- Supports a full front-to-back physical implementation flow for IC package design
- Determines the best package and substrate options early in the IC design cycle
- Provides comprehensive design rule and electrical constraint-driven layout
- Incorporates design for manufacturing (DFM) methodologies
- Improves design flow with intrinsic support for all industry standards
- Models entire design in 3D with the optional Cadence 3D Design Viewer
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