PCB power/thermal co-simulation with Cadence Sigrity PowerDC
Traditionally, IPC provides a manual procedure to estimate peak board temperature. However, it is based on a simple model and is often too pessimistic, resulting in overdesign and unnecessary cost increase.
Integrated power/thermal co-simulation provides engineers with accurate design margins and lower manufacturing costs and can accurately assess the safety issue.
Audience
Electrical Engineers and Power Integrity engineers who wish to learn how to solve power integrity and thermal issues on PCB design
Agenda
Initial Setups for Materials, Stackup and Component
Thermal Analysis Setup for Ambient Temperature and Ambient Conditions
Selecting and Setting Thermal Components
Defining Constraints, External Heat Sink and Previewing Thermal 3D Model
Simulation and Results
Thermal Result Tables, 2D Temperature Distribution, 2D Heat Flux and 3D Temperature Distributions
