Market demand for more functionality
is driving the move to multi-layer flip-chip packaging to accommodate high-pin-count designs. To efficiently design these complex packages requires a sophisticated implementation tool that addresses both electrical and physical constraints. Cadence® IC package design technology is recognized worldwide for its efficient, flexible, and reliable implementation of dense, advanced package designs. Integrated signal and power integrity analysis ensures that electrical and physical challenges can be jointly addressed throughout the design cycle. Using Cadence IC package design technology, designers can meet compressed schedule demands with first-pass success.
