Cadence 16.3 virtual event
December 2, 2009
Register now
?
Cadence recently announced the launch of its Cadence® Allegro® and OrCAD® PCB Design Release 16.3 and Allegro IC Packaging/SiP Design Release 16.3. With an array of new features and functionalities, this release delivers more flexibility to meet the challenges of high-speed design miniaturization with the utmost in productivity and predictability.

Join us on December 2, 2009 to learn what`s new in 16.3. Cadence is hosting a full-day virtual event, where you can remotely attend live presentations/demonstrations and explore a virtual exhibition hall--at your convenience and from the comfort of your own computer. Register now to save your spot at this exclusive event.

You`ll hear from Cadence technologists, strategic partners, and industry experts about 16.3 enhancements for:
• Flex-rigid routing
• 3D design viewing
• Flip-board editing
• SiP/package co-design and SiP finishing
• Easier set-up
• And much more!

We`re excited to have the following 21 companies participating in our event as sponsors and speakers, with more companies to come:
Advanced Layout Solutions, Altera, Apache Design Solutions, Artwork Conversion Software, Bayside Design, CAD Design Software, Dassault, Demos-on-Demand, DFM, Downstream, EMA, FPGAJournal, Freedom CAD Services, Fujitsu, Leventhal Design and Communications, Motorola, PCB007, PTC, Schlumberger, SI GUYS, Xilinx

The 16.3 release will be available at downloads.cadence.com and through Cadence channel partners starting early December 2009.